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Organic Nanostructures |
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Organic Nanostructures |
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基本信息·出版社：Wiley-VCH
·页码：370 页
·出版日期：2008年04月
·ISBN：3527318364
·条形码：9783527318360
·装帧：精装
·正文语种：英语
·外文书名：有机纳米结构
内容简介 在线阅读本书
Filling the need for a volume on the organic side of nanotechnology, this comprehensive overview covers all major nanostructured materials in one handy volume. Alongside metal organic frameworks, this monograph also treats other modern aspects, such as rotaxanes, catenanes, nanoporosity and catalysis. Detailed attention is paid to the chemistry, physics and materials science throughout, making this a definite must for all chemists.
作者简介 Jerry Atwood discovered liquid clathrates in 1969. Discovered spherical molecular assemblies held together by hydrogen bonds in 1997, leading to the design of nano–scale molecular assemblies using geometrical principles of Plato and Archimedes. Discovered nano–porosity of seemingly non–porous organic solids (2002), leading to new concepts in gas separation and storage (2004).
Jonathan W. Steed graduated in 1993 winning the Ramsay Medal for his Ph.D. work. Between 1993 and 1995 he was a NATO postdoctoral fellow at the University of Alabama and University of Missouri, working with Jerry Atwood, where he developed a new class of supramolecular hosts for anions. In 1995 he was appointed as a Lecturer at Kings College London. In 1998 he was awarded the Royal Society of Chemistry Meldola Medal and he was promoted to Reader in 1999. In 2004 he was appointed as Reader in Inorganic Chemistry at the University of Durham and was elected FRSC in 2005. Dr. Steed is the author of the textbook Supramolecular Chemistry (2000) and more than 190 research papers. He has published a large number of reviews, book chapters and popular articles as well as a major edited work, the Encyclopaedia of Supramolecular Chemistry (2004). He has been an Associate Editor of New Journal of Chemistry since 2001.
专业书评 The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics into perspective with the requirements for further microelectronics developments and market necessities. This two- volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon, Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
